La Configuración ES A PEDIDO 90 días según Solicitud y Requerimiento del cliente Final, en base a estas Características:
SuperMicro Storage SuperServer SSG-620P-E1CR24L, Dual socket 3rd Gen Intel® Xeon® Scalable processors, up to 72 Cores Per Node, 16 ECC DDR4-3200: LRDIMM/RDIMM, Dedicated PCIe 4.0 AIOM slot, 3 x PCIe 4.0 x16 Slots, Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN per node, 24 3.5" Hot-swap SAS3/SATA3 drives, 4 x Rear SATA/NVMe Slots, 2x SATA/NVMe M.2 (form factor: 2280), 5x 8cm hot-swap counter-rotate redundant PWM cooling fans, 1600W Redundant Power Supplies Titanium Level (96%), HBA Controller support via Broadcom® 3808, 1,3,5 años de Garantía.
(edit with the Customer Reassurance module)
(edit with the Customer Reassurance module)
(edit with the Customer Reassurance module)
La Configuración ES A PEDIDO 90 días según Solicitud y Requerimiento del cliente Final, en base a estas Características:
SuperMicro Storage SuperServer SSG-620P-E1CR24L, Dual socket 3rd Gen Intel® Xeon® Scalable processors, up to 72 Cores Per Node, 16 ECC DDR4-3200: LRDIMM/RDIMM, Dedicated PCIe 4.0 AIOM slot, 3 x PCIe 4.0 x16 Slots, Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN per node, 24 3.5" Hot-swap SAS3/SATA3 drives, 4 x Rear SATA/NVMe Slots, 2x SATA/NVMe M.2 (form factor: 2280), 5x 8cm hot-swap counter-rotate redundant PWM cooling fans, 1600W Redundant Power Supplies Titanium Level (96%), HBA Controller support via Broadcom® 3808, 1,3,5 años de Garantía. Aplicaciones clave: Servidor empresarial, iSCSI SAN, HPC, centro de datos, Procesamiento y almacenamiento de bases de datos, Base de datos corporativa, Componentes básicos de almacenamiento optimizado para dispositivos
Aplicaciones clave
Servidor empresarial
iSCSI SAN
HPC, centro de datos
Procesamiento y almacenamiento de bases de datos
Base de datos corporativa
Componentes básicos de almacenamiento optimizado para dispositivos
La Configuración de es según Solicitud y Requiermiento del cliente Final, en base a estas Caracteristicas:
Dual socket 3rd Gen Intel® Xeon® Scalable processors, up to 72 Cores Per Node
16 ECC DDR4-3200: LRDIMM/RDIMM
Dedicated PCIe 4.0 AIOM slot
3 x PCIe 4.0 x16 Slots
Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN per node
24 3.5" Hot-swap SAS3/SATA3 drives, 4 x Rear SATA/NVMe Slots, 2x SATA/NVMe M.2 (form factor: 2280)
5x 8cm hot-swap counter-rotate redundant PWM cooling fans
1600W Redundant Power Supplies Titanium Level (96%)
HBA Controller support via Broadcom® 3808
Product SKUs
SuperServer SSG-620P-E1CR24L
Motherboard
Super X12DSC-A6
Processor
CPU
Dual Socket P+ (LGA-4189)
3rd Gen Intel® Xeon® Scalable processors
Core Count
Up to 38C/76T; Up to 57MB Cache per CPU
Note
Supports 120W - 205W TDP CPUs (Air Cooled)
System Memory
Memory
Slot Count: 16 DIMM slots
Max Memory (2DPC): Up to 4TB 3200MT/s ECC DDR4 RDIMM/LRDIMM
Ver opciones de memoria
Memory Voltage
1.2V
On-Board Devices
Chipset
Intel® C621A
Network Connectivity
Via AIOM
Ver opciones de AOC
Input / Output
LAN
1 RJ45 1 GbE Dedicated BMC LAN port
USB
2 USB 3.0 ports(rear)
Video
1 VGA port
DOM
2 SuperDOM (Disk on Module) ports
System BIOS
BIOS Type
AMI 128MB SPI Flash EEPROM
Management
Power configurations
Power-on mode for AC power recovery
ACPI Power Management
Security
Hardware
Trusted Platform Module (TPM) 2.0
Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
Cryptographically Signed Firmware
Secure Boot
Secure Firmware Updates
Automatic Firmware Recovery
System Lockdown
PC Health Monitoring
CPU
4+1 Phase-switching voltage regulator
Monitors for CPU Cores, Chipset Voltages, Memory
FAN
Fans with tachometer monitoring
Pulse Width Modulated (PWM) fan connectors
Status monitor for speed control
Temperature
Monitoring for CPU and chassis environment
Thermal Control for fan connectors
Chassis
Form Factor
2U Rackmount
Model
CSE-826STS-R1K62P1
Dimensions and Weight
Height
3.5"
Width
17.2"
Depth
34"
Package
12" (H) x 29" (W) x 52" (D)
Weight
Gross Weight: 74.5 lbs (33.79 kg)
Net Weight: 52 lbs (23.59 kg)
Available Color
Silver
Front Panel
Buttons
Power On/Off
LED
HDD activity
Network activity
Power status
System information (overheat/UID)
Expansion Slots
PCI-Express (PCIe) Configuration
Default
1 PCIe 4.0 x8 LP slot
2 PCIe 4.0 x16 LP slots
1 PCIe 4.0 x16 AIOM slot (OCP 3.0 compatible)
Ver opciones de AOC
Drive Bays / Storage
Drive Bays Configuration
Default: Total 28 bays
12 front hot-swap 3.5" SAS/SATA drive bays
12 top-loading hot-swap 3.5" SAS/SATA drive bays
2 rear hot-swap 2.5" SATA drive bays
2 rear hot-swap 2.5" NVMe drive bays
Ver opciones NVMe
Ver opciones de accionamiento
M.2
2 M.2 NVMe slots (M-key 2280/22110)
Ver opciones M.2
System Cooling
Fans
Up to 5 Heavy Duty 8cm Fan(s)
Air Shroud
1 Air Shroud
Power Supply
2x 1600W Redundant Titanium Level (96%) Hot-plug power supplies
Dimension (WxHxL) 73.5 x 40 x 203 mm
Input 1000W: 100-127Vac
1000W: 100-127Vac / 50-60Hz
1600W: 200-240Vac
1600W: 200-240Vac / 50-60Hz
+12V Max: 83A / Min: 0A (100Vac-127Vac)
Max: 83.3A / Min: 0A (100Vac-127Vac)
Max: 133A / Min: 0A (200Vac-240Vac)
12V SB Max: 2.1A / Min: 0A
Output Type Backplanes (gold finger)
Certification Nivel de titanio94%+ Titanium Level
Operating Environment
ROHS
RoHS Compliant
Environmental Spec.
Operating Temperature: 10°C to 35°C (50°F to 95°F)
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 8% to 90% (Non-Condensing)
Non-operating Relative Humidity: 5% to 95% (Non-Condensing)